MEMS TRANSDUCER PACKAGE

A MEMS transducer package comprising a substrate; a filter circuit for filtering RF signals, the filter circuit comprising a resistor and a capacitor; and an IPD chip; wherein at least a portion of the filter circuit is provided within the IPD chip. La présente invention concerne un boîtier de trans...

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Bibliographic Details
Main Authors KHENKIN, Aleksey Sergeyevich, PATTEN, David, DROGOUDIS, Dimitris
Format Patent
LanguageEnglish
French
Published 27.09.2018
Subjects
BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
DEAF-AID SETS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PUBLIC ADDRESS SYSTEMS
RESONATORS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:A MEMS transducer package comprising a substrate; a filter circuit for filtering RF signals, the filter circuit comprising a resistor and a capacitor; and an IPD chip; wherein at least a portion of the filter circuit is provided within the IPD chip. La présente invention concerne un boîtier de transducteur MEMS comprenant un substrat ; un circuit de filtre pour filtrer des signaux RF, le circuit de filtre comprenant une résistance et un condensateur ; et une puce IPD ; au moins une partie du circuit de filtre étant disposée à l'intérieur de la puce IPD.
Bibliography:Application Number: WO2018GB50714