CLEANING AGENT COMPOSITION FOR SUBSTRATE FOR SEMICONDUCTOR DEVICES, METHOD FOR CLEANING SUBSTRATE FOR SEMICONDUCTOR DEVICES, METHOD FOR PRODUCING SUBSTRATE FOR SEMICONDUCTOR DEVICES, AND SUBSTRATE FOR SEMICONDUCTOR DEVICES

The present invention relates to a cleaning agent composition for a substrate for semiconductor devices, said substrate comprising at least one of a wiring line and an electrode. The wiring line and the electrode contain cobalt or a cobalt alloy; and the cleaning composition contains component (A) w...

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Bibliographic Details
Main Authors KUSANO Tomohiro, HARADA Ken, KAWASE Yasuhiro
Format Patent
LanguageEnglish
French
Japanese
Published 20.09.2018
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Summary:The present invention relates to a cleaning agent composition for a substrate for semiconductor devices, said substrate comprising at least one of a wiring line and an electrode. The wiring line and the electrode contain cobalt or a cobalt alloy; and the cleaning composition contains component (A) which is composed of at least one compound selected from the group consisting of specific compounds, and component (B) which is composed of water. La présente invention concerne une composition d'agent de nettoyage pour un substrat pour des dispositifs semi-conducteur, ledit substrat comprenant au moins l'une d'une ligne de câblage et d'une électrode. La ligne de câblage et l'électrode contiennent du cobalt ou un alliage de cobalt ; et la composition de nettoyage contient un composant (A) qui est composé d'au moins un composé choisi dans le groupe constitué de composés spécifiques, et d'un composant (B) qui est composé d'eau. 本発明は、配線及び電極のうちの少なくとも一つを有する半導体デバイス用基板の洗浄剤組成物であって、前記配線及び前記電極が、コバルト又はコバルト合金を含有し、前記洗浄剤組成物が、成分(A):特定の化合物からなる群より選ばれる少なくとも1種の化合物及び成分(B):水を含有する、半導体デバイス用基板の洗浄剤組成物に関する。
Bibliography:Application Number: WO2018JP10323