PHOTOSENSITIVE RESIN COMPOSITION

• Main Author: SAKURAI Takaaki
• Format: Patent
• Language: English; French; Japanese
• Published: 30.08.2018
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

Provided is a photosensitive resin composition which is capable of forming a positive resist film that has excellent thermal shape retainability. A photosensitive resin composition according to the present invention contains a polymer that has a monomer unit represented by general formula (I) and a polyamide-imide. (In general formula (I), R1 represents a chemical single bond or an optionally substituted divalent hydrocarbon group having 1-6 carbon atoms; and R2 represents a hydrogen atom or an optionally substituted monovalent hydrocarbon group having 1-6 carbon atoms.) L'invention concerne une composition de résine photosensible qui est apte à former un film de réserve positive qui a une excellente conservation de la forme à la chaleur. Une composition de résine photosensible selon la présente invention contient un polymère qui comprend une unité monomère représentée par la formule générale (I) et un polyamide-imide. (Dans la formule générale (I), R1 représente une liaison chimique simple ou un groupe hydrocarboné divalent facultativement substitué ayant de 1 à 6 atomes de carbone ; et R2 représente un atome d'hydrogène ou un groupe hydrocarboné monovalent facultativement substitué ayant de 1 à 6 atomes de carbone.) 耐熱形状保持性に優れたポジ型レジスト膜を形成することができる感光性樹脂組成物の提供。本発明の感光性樹脂組成物は、下記一般式（Ｉ）で表される単量体単位を有する重合体と、ポリアミドイミドとを含む。 （一般式（Ｉ）中、Ｒ１は、化学的な単結合、または置換基を有していてもよい炭素数１～６の２価の炭化水素基であり、Ｒ２は、水素原子、または置換基を有していてもよい炭素数１～６の１価の炭化水素基である。）