PACKAGE WITH UNDERFILL CONTAINMENT BARRIER

• Main Authors: ALUR, Siddharth K, VADLAMANI, Sai, DHALL, Ashish, CHAVALI, Sri Chaitra J, LEE, Kyu Oh, JAIN, Rahul, JEN, Wei-Lun K, MEHTA, Vipul V, MANEPALLI, Rahul N, ALUR, Amruthavalli P
• Format: Patent
• Language: English; French
• Published: 05.07.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material di...