INSULATION LAYER MANUFACTURING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD

• Main Authors: CHOI, Bo Yun, LEE, Kwang Joo, JEONG, Woo Jae, JEONG, Min Su, KYUNG, You Jin, CHOI, Byung Ju
• Format: Patent
• Language: English; French; Korean
• Published: 03.05.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The present invention relates to an insulation layer manufacturing method according to which the efficiency of the process may be improved since manufacturing is achieved by a quicker and easier method, the physical damage to an insulation layer may be prevented, and it is easy to control the thickness, and to a multilayer printed circuit board manufacturing method using an insulation layer obtained by the said insulation layer manufacturing method. La présente invention concerne un procédé de fabrication de couche d'isolation, suivant lequel l'efficacité du procédé peut être améliorée étant donné que la fabrication est effectuée par un procédé plus rapide et plus facile, que les dommages physiques subis par une couche d'isolation peuvent être empêchés et qu'il est facile de régler l'épaisseur, l'invention concernant également un procédé de fabrication de carte de circuit imprimé multicouche utilisant une couche d'isolation obtenue par ledit procédé de fabrication de couche d'isolation. 본 발명은, 보다 빠르면서도 간단한 방법으로 제조가 가능하여 공정의 효율성이 향상될 수 있으며, 절연층의 물리적 손상을 방지할 수 있고, 두께 조절이 용이한 절연층 제조방법 및 상기 절연층 제조방법으로부터 얻어지는 절연층을 이용한 다층인쇄회로기판 제조방법에 관한 것이다.