RETAINING RING FOR CMP

A retaining ring includes a generally annular body having an inner surface to constrain a substrate and a bottom surface, the bottom surface having a plurality of channels extending from an outer surface to the inner surface, and a plurality of islands separated by the channels and providing a conta...

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Main Authors RONDUM, Erik S, LI, Thomas, LEE, Christopher Heung-Gyun, DIAO, Jie, OH, Jeonghoon, IYER, Anand N, LEE, Wei-Cheng, NAGENGAST, Andrew J, ZHANG, Huanbo
Format Patent
LanguageEnglish
French
Published 26.07.2018
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:A retaining ring includes a generally annular body having an inner surface to constrain a substrate and a bottom surface, the bottom surface having a plurality of channels extending from an outer surface to the inner surface, and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad, wherein the contact area is about 15-40% of a plan area of the bottom surface. L'invention concerne une bague de retenue comprenant un corps généralement annulaire présentant une surface intérieure servant à maintenir un substrat et une surface inférieure, la surface inférieure présentant une pluralité de canaux s'étendant d'une surface extérieure vers la surface intérieure et une pluralité d'îlots séparés par les canaux et ménageant une zone de contact entrant en contact avec un tampon de polissage, la zone de contact représentant environ 15 à 40 % d'une zone du plan de la surface inférieure.
Bibliography:Application Number: WO2017US43551