COMPONENT WITH A THIN-LAYER COVERING AND METHOD FOR ITS PRODUCTION

A component (B) comprising a carrier (TR), on which a functional structure (FS) is covered by a thin-layer covering (DSA) spanning across and resting on the carrier. On a planarization layer arranged above the thin-layer covering (DSA), a wiring level (M1, M2) is realized, which comprises structured...

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Bibliographic Details
Main Authors KAMIJIMA, Akifumi, METZGER, Thomas, Dr
Format Patent
LanguageEnglish
French
Published 04.01.2018
Subjects
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
RESONATORS
TRANSPORTING
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Summary:A component (B) comprising a carrier (TR), on which a functional structure (FS) is covered by a thin-layer covering (DSA) spanning across and resting on the carrier. On a planarization layer arranged above the thin-layer covering (DSA), a wiring level (M1, M2) is realized, which comprises structured conductor paths and which is connected via through-connections to the functional structure (FS). Cette invention concerne un composant (B) comprenant un support (TR), sur lequel une structure fonctionnelle (FS) est recouverte d'un revêtement à couche mince (DSA) s'étendant sur le support et reposant sur celui-ci. Sur une couche de planarisation disposée au-dessus du revêtement à couche mince (DSA), un niveau de câblage (M1, M2) est réalisé, qui comprend des pistes conductrices structurées et qui est connecté par l'intermédiaire de connexions transversales à la structure fonctionnelle (FS).
Bibliography:Application Number: WO2017US39257