INSULATING LAYER FABRICATION METHOD, ARRAY FABRICATION METHOD AND ARRAY SUBSTRATE

An insulating layer fabrication method, an array substrate fabrication method and an array substrate; wherein the insulating layer fabrication method comprises the steps of: (S101) depositing an insulating layer (20) on a substrate (10); (S102) performing exposure development processing on the insul...

Full description

Saved in:
Bibliographic Details
Main Author FAN, Deyong
Format Patent
LanguageChinese
English
French
Published 04.01.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:An insulating layer fabrication method, an array substrate fabrication method and an array substrate; wherein the insulating layer fabrication method comprises the steps of: (S101) depositing an insulating layer (20) on a substrate (10); (S102) performing exposure development processing on the insulating layer (20) so as to obtain the insulating layer (20) having an opening (21); (S103) performing photocuring processing on the insulating layer (20) having the opening (21); (S104) performing high-temperature annealing processing on the insulating layer (20) having the opening (21) after completion of the photocuring processing. The insulating layer fabrication method may reduce deformation of the insulating layer opening. L'invention concerne un procédé de fabrication de couche isolante, un procédé de fabrication de substrat matriciel et un substrat matriciel où le procédé de fabrication de couche isolante comprend les étapes suivantes : (S101) déposer une couche isolante (20) sur un substrat (10); (S102) effe
Bibliography:Application Number: WO2016CN90652