APPARATUS AND METHOD FOR PLACING COMPONENTS ON AN ELECTRONIC CIRCUIT

An apparatus and method for placing components on an electronic circuit is disclosed. An adhesive applicator applies an adhesive to the electronic circuit. A component pick-and-place head places a component on the adhesive. A heater supplies sufficient heat to the electronic circuit to melt the adhe...

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Bibliographic Details
Main Authors MURZYNOWSKI, Alan R, CYMAN, Theodore F, KANFOUSH, Daniel E
Format Patent
LanguageEnglish
French
Published 20.07.2017
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:An apparatus and method for placing components on an electronic circuit is disclosed. An adhesive applicator applies an adhesive to the electronic circuit. A component pick-and-place head places a component on the adhesive. A heater supplies sufficient heat to the electronic circuit to melt the adhesive and an outer portion of a contact pin of the component. La présente invention concerne un appareil et un procédé pour placer des composants sur un circuit électronique. Un applicateur d'adhésif applique un adhésif sur le circuit électronique. Une tête de prélèvement et de placement de composant place un composant sur l'adhésif. Un élément chauffant fournit suffisamment de chaleur au circuit électronique pour faire fondre l'adhésif et une partie extérieure d'une broche de contact du composant.
Bibliography:Application Number: WO2017US13464