METHOD OF MANUFACTURING CIRCUIT BOARD

The present specification relates to a method of manufacturing a circuit board. In particular, the present specification relates to a method of manufacturing a circuit board and an electronic device including same. La présente invention concerne un procédé de fabrication d'une carte de circuit...

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Bibliographic Details
Main Authors MYUNG, Ji Eun, SEO, Han Min, LEE, Kiseok, SON, Yong Goo, LEE, Seung Heon, LIM, Chang Yoon
Format Patent
LanguageEnglish
French
Korean
Published 13.07.2017
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The present specification relates to a method of manufacturing a circuit board. In particular, the present specification relates to a method of manufacturing a circuit board and an electronic device including same. La présente invention concerne un procédé de fabrication d'une carte de circuit imprimé. La présente invention concerne, en particulier, un procédé de fabrication d'une carte de circuit imprimé, et un dispositif électronique incluant cette dernière. 본 명세서는 회로기판의 제조방법에 관한 것이다. 구체적으로, 본 명세서는 회로기판 및 이를 포함하는 전자소자의 제조방법에 관한 것이다.
Bibliography:Application Number: WO2017KR00081