POLYIMIDE RESIN, METAL LAMINATE USING SAME, AND PRINTED CIRCUIT BOARD INCLUDING SAME

• Main Authors: JEONG, Jisoo, JEONG, Inki, KIM, Wonkyum
• Format: Patent
• Language: English; French; Korean
• Published: 29.06.2017
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The present invention relates to a polyimide resin, a metal laminate using the same, and a printed circuit board including the same, wherein the polyimide resin has an excellent thermal conductivity. Therefore, the present invention can provide a printed circuit board having an improved heat radiating property. La présente invention concerne une résine de polyimide, un stratifié métallique l'utilisant, et une carte de circuit imprimé comprenant ce dernier, la résine de polyimide ayant une excellente conductivité thermique. La présente invention permet ainsi de fabriquer une carte de circuit imprimé présentant des propriétés de rayonnement thermique améliorées. 본 발명은 폴리이미드 수지, 이를 이용한 금속 적층체 및 이를 포함하는 인쇄회로기판에 관한 것으로, 상기 폴리이미드 수지의 열전도도가 우수하기 때문에 본 발명은 방열성이 향상된 인쇄회로기판을 제공할 수 있다.