THERMOPLASTIC RESIN COMPOSITION AND MOLDED PRODUCT CONTAINING SAME

• Main Authors: PARK, Jeong Eun, JEONG, Hee Yun, HONG, Chang Min, KWON, Kee Hae
• Format: Patent
• Language: English; French; Korean
• Published: 29.06.2017
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The present invention relates to a thermoplastic resin composition and a molded product containing the same, the composition comprising: a base resin comprising a polycarbonate resin, a polyester resin, and a polyalkyl(meth)acrylate resin; a diene-based impact modifier; and an acrylic impact modifier. La présente invention concerne une composition de résine thermoplastique et un produit moulé la contenant, ladite composition comprenant : une résine de base comprenant une résine de polycarbonate, une résine de polyester et une résine de polyalkyl(méth)acrylate; un modifiant choc à base de diène; et un modifiant choc acrylique. 본 발명은 폴리카보네이트 수지, 폴리에스테르 수지 및 폴리알킬(메타)아크릴레이트 수지를 포함하는 기초 수지; 디엔계 충격 보강제; 및 아크릴계 충격 보강제를 포함하는 열가소성 수지 조성물 및 이를 포함하는 성형품에 관한 것이다.