COMPONENT EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING COMPONENT EMBEDDED SUBSTRATE

• Main Authors: AOKI, Kentaro, MATSUMOTO, Tohru, TODA, Mitsuaki
• Format: Patent
• Language: English; French; Japanese
• Published: 22.06.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

A component embedded substrate (30) has: a first insulator (13) containing an insulating resin material; an IC component (4), which has a first terminal that is provided on the first surface side, and a second terminal that is provided on the second surface side having a structure more fragile than...