INTEGRATED CIRCUIT WITH CHIP-ON-CHIP AND CHIP-ON-SUBSTRATE CONFIGURATION

• Main Authors: LIU, Ansheng, YIM, Myung Jin, DOSUNMU, Olufemi I
• Format: Patent
• Language: English; French
• Published: 08.06.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Embodiments of the present disclosure provide an apparatus comprising an integrated circuit with a chip-on-chip and chip-on-substrate configuration. In one instance, apparatus may include optical transceiver with opto-electronic component disposed in a first portion of a die, and a trace coupled wit...