DEPOSITION MASK, METHOD FOR MANUFACTURING DEPOSITION MASK, AND METAL PLATE

• Main Authors: IKENAGA Chikao, FURUSHOU Hiroki, SHIMAZAKI Yo, SEKI Kentarou, HATSUTA Chiaki
• Format: Patent
• Language: English; French; Japanese
• Published: 06.04.2017
• Subjects: APPARATUS THEREFOR; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

This deposition mask is provided with a mask body and through-holes, which are provided in the mask body and through which a deposition material passes when being deposited on a substrate targeted for deposition. The mask body satisfies y≥950 and y≥23x-1280, where x (GPa) is indentation elastic modulus and y (MPa) is 0.2% proof stress. Le masque de dépôt d'après la présente invention comprend un corps de masque et des trous traversants situés dans le corps de masque et par lesquels passe un matériau de dépôt lorsqu'il est déposé sur un substrat ciblé pour un dépôt. Le corps de masque satisfait les relations y ≥ 950 et y ≥ 23x-1280, où x (GPa) est un module élastique d'indentation et y (MPa) est une limite conventionnelle d'élasticité de 0,2 %. 蒸着マスクは、マスク本体と、マスク本体に設けられ、蒸着材料を被蒸着基板に蒸着させる際に蒸着材料が通過する貫通孔と、を備えている。マスク本体は、インデンテーション弾性率をｘ（ＧＰａ）、０．２％耐力をｙ（ＭＰａ）としたときに、　ｙ≧９５０、かつ、ｙ≧２３ｘ－１２８０ を満たしている。