WAFER CENTERING DEVICE FOR MEASUREMENT APPARATUS

The present invention provides a wafer centering device for a measurement apparatus, the device comprising: a body unit; a guide unit which is installed in the body unit, has a support part for supporting a wafer, and has a through-hole and; and a displacement unit which is formed to be moved in the...

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Bibliographic Details
Main Authors LEE, Gyu-Seong, JUNG, Hye-Suk, KWON, Young-Jong
Format Patent
LanguageEnglish
French
Korean
Published 16.03.2017
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Summary:The present invention provides a wafer centering device for a measurement apparatus, the device comprising: a body unit; a guide unit which is installed in the body unit, has a support part for supporting a wafer, and has a through-hole and; and a displacement unit which is formed to be moved in the through-hole and has a pusher for moving the wafer on the support part. La présente invention concerne un dispositif de centrage de plaquette destiné à un appareil de mesure, le dispositif comportant : une unité de corps ; une unité de guidage qui est installée dans l'unité de corps, qui présente une partie de support destinée à porter une plaquette et un trou traversant ; une unité de déplacement qui est formée de manière à être déplacée dans le trou traversant et qui possède un poussoir pour déplacer la plaquette sur la partie de support. 본 발명은, 바디 유닛; 상기 바디 유닛에 설치되고, 웨이퍼를 지지하는 지지부와, 관통홀을 가지는 가이드 유닛; 및 상기 관통홀 내에서 이동되도록 형성되어 상기 웨이퍼를 상기 지지부 상에서 이동시키는 푸셔를 구비하는 변위 유닛을 포함하는, 계측기용 웨이퍼 센터링 디바이스를 제공한다.
Bibliography:Application Number: WO2016KR09799