ELECTRONIC COMPONENT MOUNTING PACKAGE AND ELECTRONIC DEVICE USING SAME

• Main Authors: TANIGUCHI, Masahiko, SHIRASAKI, Takayuki, MIYAUCHI, Takashi
• Format: Patent
• Language: English; French; Japanese
• Published: 02.03.2017
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES USING STIMULATED EMISSION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An electronic component mounting package has a dielectric board disposed between first portions of a pair of signal terminals that protrude from a first surface of a substrate toward one side in a thickness direction, wherein the height of the dielectric board is lower than the height of the first p...