WAFER ELECTROPLATING CHUCK ASSEMBLY

A wafer is placed into a chuck assembly within an electroplating system. The chuck assembly includes a backing plate assembly engageable with a ring. A hub may be provided on one side of the backing plate assembly for attaching the chuck assembly to a rotor of a processor for electroplating a wafer....

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Bibliographic Details
Main Authors HARRIS, Randy A, WINDHAM, Michael
Format Patent
LanguageEnglish
French
Published 12.01.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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