METHODS OF FORMING SENSOR INTEGRATED PACKAGES AND STRUCTURES FORMED THEREBY

Methods of forming sensor integrated package devices and structures formed thereby are described. An embodiment includes providing a substrate core, wherein a first conductive trace structure and a second conductive trace structure are disposed on the substrate core, forming a cavity between the fir...

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Bibliographic Details
Main Authors SALAMA, Islam A, KONG, Lay Wai, SOTO GONZALEZ, Javier, LEE, Kyu Oh, EID, Feras, ZHOU, Zheng, OSTER, Sasha N
Format Patent
LanguageEnglish
French
Published 06.10.2016
Subjects
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
TRANSPORTING
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Summary:Methods of forming sensor integrated package devices and structures formed thereby are described. An embodiment includes providing a substrate core, wherein a first conductive trace structure and a second conductive trace structure are disposed on the substrate core, forming a cavity between the first conductive trace structure and the second conductive trace structure, and placing a magnet on a resist material disposed on a portion of each of the first and second conductive trace structures, wherein the resist material does not extend over the cavity. L'invention concerne des procédés de formation de boîtiers à capteurs intégrés et les structures ainsi formées. Un mode de réalisation consiste à utiliser un substrat central, sur lequel sont disposées une première structure de piste conductrice et une seconde structure de piste conductrice, à former une cavité entre la première structure de piste conductrice et la seconde structure de piste conductrice, et à placer un aimant sur une résine photosensible disposée sur une partie de chacune des première et seconde structures de piste conductrice, la résine photosensible ne s'étendant pas au-dessus de la cavité.
Bibliography:Application Number: WO2016US19574