POWER MODULE

• Main Author: TAYA, Masaki
• Format: Patent
• Language: English; French; Japanese
• Published: 06.10.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To obtain a power module in which peeling of a silicone gel and an insulating substrate from each other and occurrence of bubbles at high or low temperatures or at a high usage voltage are minimized, whereby it becomes possible to minimize degradation of the insulating performance and obtain reliabl...