HOT MELT ADHESIVE COMPOSITIONS THAT INCLUDE ETHYLENE COPOLYMER

The invention is directed to hot melt adhesive compositions that include one or more ethylene based copolymers, no greater than about 27 % by weight of a tackifying agent and a wax. L'invention concerne des compositions adhésives thermofusibles qui comprennent un ou plusieurs copolymères à base...

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Bibliographic Details
Main Authors SCHMIDT, SCOTT, C, KAUFFMAN, THOMAS, F
Format Patent
LanguageEnglish
French
Published 11.08.2016
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:The invention is directed to hot melt adhesive compositions that include one or more ethylene based copolymers, no greater than about 27 % by weight of a tackifying agent and a wax. L'invention concerne des compositions adhésives thermofusibles qui comprennent un ou plusieurs copolymères à base d'éthylène, qui ne constituent pas plus d'environ 27 % en poids d'un agent donnant du collant et d'une cire.
Bibliography:Application Number: WO2016US16577