MULTILAYER PRINTED WIRING BOARD, MULTILAYER METAL-CLAD LAMINATED BOARD, AND RESIN-COATED METAL FOIL

• Main Authors: HARADA, RYU, TOCHIHIRA, JUN, KOYAMA, MASAYA, TAKAHASHI, HIROAKI, KOMORI, KIYOTAKA
• Format: Patent
• Language: English; French; Japanese
• Published: 28.07.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING

The present invention relates to a multilayer printed wiring board which has one or more insulating layers 2 and which is formed by alternately laminating conductor layers 1 and insulating layers 2. Each of the one or more insulating layers 2 is formed from a polyolefin resin layer 3 only, a liquid...