MOUNTING BOARD MANUFACTURING DEVICE AND MOUNTING BOARD MANUFACTURING METHOD

• Main Authors: MASUDA YUKINORI, YAMAGUCHI KATSUHIRO, TAKAHARA TOMOKI, NAKATA NOBUHIRO
• Format: Patent
• Language: English; French; Japanese
• Published: 21.07.2016
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FREQUENCY-CHANGING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PHYSICS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF

A mounting board manufacturing device is characterized by comprising: a first FPC-side compression bonding unit 51 that performs thermal compression bonding of a first mounted component group 31 including a one-end side mounted component which is, from among a plurality of flexible substrates 13 arr...