SUSCEPTOR REGENERATION METHOD
The present invention relates to a susceptor regeneration method comprising heating a susceptor having a TaC coating layer formed thereon to 1,500°C to 2,700°C for 10 to 300 minutes under hydrogen supply conditions to thereby remove an SiC layer from the surface of the TaC coating layer. The present...
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Main Author | |
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Format | Patent |
Language | English French Korean |
Published |
16.06.2016
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention relates to a susceptor regeneration method comprising heating a susceptor having a TaC coating layer formed thereon to 1,500°C to 2,700°C for 10 to 300 minutes under hydrogen supply conditions to thereby remove an SiC layer from the surface of the TaC coating layer. The present invention is capable of removing the SiC layer through a heat treatment in a hydrogen atmosphere without damaging the TaC coating layer, and thus has the effect of preventing the exposure of a graphite matrix and the occurrence of foreign matter due to damage to the TaC coating layer.
La présente invention se rapporte à un procédé de régénération de suscepteur consistant à chauffer un suscepteur sur lequel est formée une couche de revêtement en carbure de tantale (TaC) à une température comprise entre 1 500 °C et 2 700 °C pendant une période de temps comprise entre 10 et 300 minutes dans des conditions d'alimentation en hydrogène afin d'éliminer de ce fait une couche de carbure de silicium (SiC) de la surface de la couche de revêtement en carbure de tantale. La présente invention peut éliminer la couche de carbure de silicium au moyen d'un traitement thermique sous atmosphère d'hydrogène sans endommager la couche de revêtement en carbure de tantale, et a ainsi pour effet d'empêcher l'exposition d'une matrice de graphite et l'apparition de matières étrangères à cause de dommages à la couche de revêtement en carbure de tantale.
본 발명은 서셉터 재생방법에 관한 것으로, TaC 코팅층이 형성된 서셉터를 수소 공급 조건에서 1500 내지 2700℃로 10 내지 300분간 가열하여 상기 TaC 코팅층의 표면에서 SiC층을 제거한다. 본 발명은 수소분위기에서 열처리를 통해 TaC 코팅층에 손상을 주지 않고 SiC층을 제거할 수 있어, TaC 코팅층 손상에 의한 그라파이트 모재의 노출과 이물 발생을 방지할 수 있는 효과가 있다. |
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Bibliography: | Application Number: WO2015KR02164 |