POLISHING OF HARD SUBSTRATES WITH SOFT-CORE COMPOSITE PARTICLES

• Main Authors: SINGH, RAJIV, K, ARJUNAN, ARUL, CHAKKARAVARTHI, BALASUNDARAM, KANNAN, SINGH, DEEPIKA, BAI, WEI
• Format: Patent
• Language: English; French
• Published: 03.03.2016
• Subjects: ADHESIVES; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CRYSTAL GROWTH; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; POLISHES; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE; REFINING BY ZONE-MELTING OF MATERIAL; SEMICONDUCTOR DEVICES; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE; SINGLE-CRYSTAL-GROWTH; SKI WAXES; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL

A chemical mechanical polishing (CMP) includes providing a slurry including composite particles dispersed in a water-based carrier that comprise a plurality of hard particles on an outer surface of a soft-core particle. The hard particles have a Mohs hardness at least 1 greater than a Mohs hardness of the soft core particle and/or a Vickers hardness at least 500 Kg/mm2 greater than the soft-core particle. A substrate having a substrate surface with a hardness greater than a Mohs number of 6 or a Vickers hardness greater than 1,000 kg/mm2 is placed into a CMP apparatus having a rotating polishing pad, and CMP is performed with the rotating polishing pad and the slurry to polish the substrate surface. L'invention concerne un polissage mécanique chimique (CMP) consistant à utiliser une bouillie contenant des particules composites dispersées dans un véhicule à base d'eau qui comprennent une pluralité de particules dures sur une surface extérieure d'une particule à coeur mou. Les particules dures ont des duretés Mohs supérieures d'au moins 1 à une dureté Mohs de la particule à coeur mou et/ou une dureté Vickers supérieure d'au moins 500 Kg/mm2 à celle de la particule à coeur mou. Un substrat ayant une surface de substrat ayant une dureté Mohs supérieure à 6 ou une dureté Vickers supérieure à 1000 kg/mm2 est placé dans un appareil de CMP ayant un patin de polissage tournant, et un CMP est effectué à l'aide du patin de polissage tournant et de la bouillie afin de polir la surface du substrat.