COMPOSITION, USE THEREOF AND METHOD FOR ELECTRODEPOSITING GOLD CONTAINING LAYERS
The present invention relates to a composition and method for electrodepositing gold containing layers using the composition and the use of mercapto-triazole compounds as anti-immersion additives. The composition contains a mercapto-triazole compound which acts as an anti-immersion additive. The com...
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Main Authors | , , |
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Format | Patent |
Language | English French |
Published |
03.03.2016
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention relates to a composition and method for electrodepositing gold containing layers using the composition and the use of mercapto-triazole compounds as anti-immersion additives. The composition contains a mercapto-triazole compound which acts as an anti-immersion additive. The composition and method are suited for depositing functional or hard gold or gold alloys that can be applied in the industry as contact material of electrical connectors for high reliability applications.
La présente invention concerne une composition et un procédé d'électrodéposition de couches contenant de l'or à l'aide de la composition et l'utilisation de composés mercaptotriazoles comme additifs anti-immersion. La composition contient un composé mercaptotriazoles qui agit comme un additif anti-immersion. La composition et le procédé sont adaptés à la déposition fonctionnelle ou à l'or dur ou aux alliages d'or qui peuvent être appliqués dans l'industrie comme matériau de contact de connecteurs électriques pour des applications à fiabilité élevée. |
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Bibliography: | Application Number: WO2015EP69234 |