COPPER-CONTAINING CONDUCTIVE PASTES AND ELECTRODES MADE THEREFROM
Disclosed herein are copper-containing (Cu-containing) conductive pastes, copper (Cu) electrodes formed by firing the Cu-containing conductive paste over a substrate, and articles comprising a structural element with such Cu electrodes, wherein, the Cu-containing conductive paste contains a powder m...
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Main Authors | , |
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Format | Patent |
Language | English French |
Published |
03.03.2016
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Subjects | |
Online Access | Get full text |
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Summary: | Disclosed herein are copper-containing (Cu-containing) conductive pastes, copper (Cu) electrodes formed by firing the Cu-containing conductive paste over a substrate, and articles comprising a structural element with such Cu electrodes, wherein, the Cu-containing conductive paste contains a powder mixture of Cu, Ge, and B particles dispersed in an organic medium.
La présente invention concerne des pâtes conductrices contenant du cuivre (contenant du Cu), des électrodes de cuivre (Cu) formées par cuisson de la pâte conductrice contenant du Cu sur un substrat, et des articles comprenant un élément structural doté de telles électrodes de Cu, laquelle pâte conductrice contenant du Cu contient un mélange de poudres de particules de Cu, de Ge et de B dispersées dans un milieu organique. |
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Bibliography: | Application Number: WO2014CN85386 |