COPPER-CONTAINING CONDUCTIVE PASTES AND ELECTRODES MADE THEREFROM

Disclosed herein are copper-containing (Cu-containing) conductive pastes, copper (Cu) electrodes formed by firing the Cu-containing conductive paste over a substrate, and articles comprising a structural element with such Cu electrodes, wherein, the Cu-containing conductive paste contains a powder m...

Full description

Saved in:
Bibliographic Details
Main Authors MU, MINFANG, WU, YUNDAN
Format Patent
LanguageEnglish
French
Published 03.03.2016
Subjects
ALLOYS
BASIC ELECTRIC ELEMENTS
CABLES
CASTING
CHEMISTRY
CONDUCTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FERROUS OR NON-FERROUS ALLOYS
INSULATORS
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
METALLURGY
PERFORMING OPERATIONS
POWDER METALLURGY
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SEMICONDUCTOR DEVICES
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WORKING METALLIC POWDER
Online AccessGet full text

Cover

More Information
Summary:Disclosed herein are copper-containing (Cu-containing) conductive pastes, copper (Cu) electrodes formed by firing the Cu-containing conductive paste over a substrate, and articles comprising a structural element with such Cu electrodes, wherein, the Cu-containing conductive paste contains a powder mixture of Cu, Ge, and B particles dispersed in an organic medium. La présente invention concerne des pâtes conductrices contenant du cuivre (contenant du Cu), des électrodes de cuivre (Cu) formées par cuisson de la pâte conductrice contenant du Cu sur un substrat, et des articles comprenant un élément structural doté de telles électrodes de Cu, laquelle pâte conductrice contenant du Cu contient un mélange de poudres de particules de Cu, de Ge et de B dispersées dans un milieu organique.
Bibliography:Application Number: WO2014CN85386