HEAT-RESISTANT ADHESIVE SHEET FOR SEMICONDUCTOR INSPECTION AND SEMICONDUCTOR INSPECTION METHOD

• Main Authors: KUTSUMI, MASANOBU, NAKAJIMA, GOSUKE
• Format: Patent
• Language: English; French; Japanese
• Published: 19.11.2015
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

Provided is a heat-resistant adhesive sheet in which deformation of the adhesive sheet as a result of heating does not readily occur. The adhesive sheet, which is formed by laminating an adhesive agent layer on a substrate, is characterised in that: the substrate exhibits a heat shrinkage property;...