TRANSPARENT LAYER THICKNESS MEASUREMENT

Methods and apparatus to measure the thickness of a transparent material layer printed on a substrate are described. In one example, the material is illuminated, and the intensity of light received from a first and second portion of material is measured. An average value related to attenuation is us...

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Bibliographic Details
Main Authors HANNOCH, RON, TZOMIK, INNA, PERLMUTTER, PINNI, FORGACS, PETER
Format Patent
LanguageEnglish
French
Published 05.11.2015
Subjects
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
TESTING
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Summary:Methods and apparatus to measure the thickness of a transparent material layer printed on a substrate are described. In one example, the material is illuminated, and the intensity of light received from a first and second portion of material is measured. An average value related to attenuation is used to determine a thickness of the material layer. L'invention concerne des procédés et un appareil pour mesurer l'épaisseur d'une couche de matériau transparent imprimée sur un substrat. Dans un exemple, le matériau est éclairé, et l'intensité de la lumière reçue d'une première et d'une seconde partie du matériau est mesurée. Une valeur moyenne rapportée à l'atténuation est utilisée pour déterminer une épaisseur de la couche de matériau.
Bibliography:Application Number: WO2014EP58681