EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING AGENT, AND SEMICONDUCTOR DEVICE
An epoxy resin composition characterized by including (A) an epoxy resin, (B) a curing agent, (C) 0.1-10% by mass of a silica filler having an average particle diameter of 10-100 nm, and (D) 40-75% by mass of a silica filler having an average particle diameter of 0.3-5 µm, the epoxy resin compositio...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | English French Japanese |
Published |
04.06.2015
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | An epoxy resin composition characterized by including (A) an epoxy resin, (B) a curing agent, (C) 0.1-10% by mass of a silica filler having an average particle diameter of 10-100 nm, and (D) 40-75% by mass of a silica filler having an average particle diameter of 0.3-5 µm, the epoxy resin composition including a total of 40.1-77% by mass of component (C) and component (D).
La présente invention concerne une composition de résine époxy caractérisée en ce qu'elle comprend (A) une résine époxy, (B) un agent de durcissement, (C) de 0,1 à 10 % en masse d'une charge de silice ayant un diamètre de particule moyen de 10 à 100 nm, et (D) de 40 à 75 % en masse d'une charge de silice ayant un diamètre de particule moyen de 0,3 à 5 µm, la composition de résine époxy comprenant un total de 40,1 à 77 % en masse de composant (C) et de composant (D).
エポキシ樹脂組成物は、(A)エポキシ樹脂と、(B)硬化剤と、(C)0.1~10質量%の、平均粒径10~100nmのシリカフィラーと、(D)40~75質量%の、平均粒径0.3μm~5μmのシリカフィラーとを含み、前記(C)成分および前記(D)成分を、合計で40.1~77質量%含むことを特徴とする。 |
---|---|
AbstractList | An epoxy resin composition characterized by including (A) an epoxy resin, (B) a curing agent, (C) 0.1-10% by mass of a silica filler having an average particle diameter of 10-100 nm, and (D) 40-75% by mass of a silica filler having an average particle diameter of 0.3-5 µm, the epoxy resin composition including a total of 40.1-77% by mass of component (C) and component (D).
La présente invention concerne une composition de résine époxy caractérisée en ce qu'elle comprend (A) une résine époxy, (B) un agent de durcissement, (C) de 0,1 à 10 % en masse d'une charge de silice ayant un diamètre de particule moyen de 10 à 100 nm, et (D) de 40 à 75 % en masse d'une charge de silice ayant un diamètre de particule moyen de 0,3 à 5 µm, la composition de résine époxy comprenant un total de 40,1 à 77 % en masse de composant (C) et de composant (D).
エポキシ樹脂組成物は、(A)エポキシ樹脂と、(B)硬化剤と、(C)0.1~10質量%の、平均粒径10~100nmのシリカフィラーと、(D)40~75質量%の、平均粒径0.3μm~5μmのシリカフィラーとを含み、前記(C)成分および前記(D)成分を、合計で40.1~77質量%含むことを特徴とする。 |
Author | ABE, NOBUYUKI OKOSHI, KODAI YAMAZAWA, TOMOYA KOHARA, KAZUYUKI |
Author_xml | – fullname: YAMAZAWA, TOMOYA – fullname: OKOSHI, KODAI – fullname: ABE, NOBUYUKI – fullname: KOHARA, KAZUYUKI |
BookMark | eNrjYmDJy89L5WTwcw3wj4hUCHIN9vRTcPb3DfAP9gzx9PfTUQh29fV09vdzCXUO8Q8C8hx9PP3cFRzdXf1CdBQc_VzQFLi4hnk6u_IwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvhwfyMDQ1MDc0tzA3NHQ2PiVAEAJIsxZA |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
DocumentTitleAlternate | エポキシ樹脂組成物、半導体封止剤および半導体装置 COMPOSITION DE RÉSINE ÉPOXY, AGENT D'ÉTANCHÉITÉ DE SEMI-CONDUCTEUR, ET DISPOSITIF À SEMI-CONDUCTEUR |
ExternalDocumentID | WO2015079707A1 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_WO2015079707A13 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 15:07:07 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English French Japanese |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_WO2015079707A13 |
Notes | Application Number: WO2014JP05966 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150604&DB=EPODOC&CC=WO&NR=2015079707A1 |
ParticipantIDs | epo_espacenet_WO2015079707A1 |
PublicationCentury | 2000 |
PublicationDate | 20150604 |
PublicationDateYYYYMMDD | 2015-06-04 |
PublicationDate_xml | – month: 06 year: 2015 text: 20150604 day: 04 |
PublicationDecade | 2010 |
PublicationYear | 2015 |
RelatedCompanies | NAMICS CORPORATION |
RelatedCompanies_xml | – name: NAMICS CORPORATION |
Score | 3.1032612 |
Snippet | An epoxy resin composition characterized by including (A) an epoxy resin, (B) a curing agent, (C) 0.1-10% by mass of a silica filler having an average particle... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
Title | EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING AGENT, AND SEMICONDUCTOR DEVICE |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150604&DB=EPODOC&locale=&CC=WO&NR=2015079707A1 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfR1dT8Iw8ELQqG-KGj_QLNHsicUB-3wgZrQDZqQlMBCfiB1dojFAZMa_73WgEh946_X6ecn1ete7K8CtY_uJtKRpmImwDSup-YbneJZRE0KqyMU69lLeFszpDK2HsT0uwPtPLEyeJ_QrT46IHJUgv2f5eb34M2LR3LdyeSdesWp-34obVF9rx6t0eTptNsIep5zohKDeprP-Cuf6rukGqCvtqIu0yrQfjpoqLmWxKVRah7Dbw_Fm2REU3l5KsE9-_l4rwV53_eSNxTX3LY-B4XTjZw1pFjGN8G6PDyJlYapoA0VNzuiQxLyPUPAYsbYWtEMWV7SA0X8NaDiKSHgCN60wJh0DFzb5pcPkiW_uon4Kxdl8Js9A81I7TYXjSttMrFo1FV7qyOrUNaeJ7aaefw7lbSNdbEdfwoECc_8oqwzF7ONTXqEkzsR1TsBvOqGFzA |
link.rule.ids | 230,309,786,891,25594,76906 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfR1dT8Iw8ELUiG-KGj9Ql2j2xOKAbd0eiBntgCm0BAbiE7GjSzQGiMz4920HKPGBt7bXj-sl1-td764Ad47txcISpmHG3DasuOIZruNaRoVzoSIXq3KU8ragTmtgPY7sUQ4-1rEwWZ7Q7yw5ouSoWPJ7mp3X8z8jFsl8Kxf3_E02zR4aUY3oK-14mS5PJ_Va0GWEYR1jqbfptLeEIQ-ZyJe60i5S-XnV5WlYV3Ep802h0jiEva6cb5oeQe79tQB5vP57rQD7ndWTtyyuuG9xDFQuN3rRJM1CqmHW6bJ-qCxMJa2vqMkoGeCI9WTNb4e0qfnNgEYlzafkXwcSDEMcnMBtI4hwy5CIjX_pMH5mm7uonsLOdDYVZ6C5iZ0k3EHCNmOrUk64mziiPEHmJLZR4nrnUNw208V28A3kW1GnPZaYP13CgQJlvlJWEXbSzy9xJaVyyq8zYv4ApUuIuQ |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=EPOXY+RESIN+COMPOSITION%2C+SEMICONDUCTOR+SEALING+AGENT%2C+AND+SEMICONDUCTOR+DEVICE&rft.inventor=YAMAZAWA%2C+TOMOYA&rft.inventor=OKOSHI%2C+KODAI&rft.inventor=ABE%2C+NOBUYUKI&rft.inventor=KOHARA%2C+KAZUYUKI&rft.date=2015-06-04&rft.externalDBID=A1&rft.externalDocID=WO2015079707A1 |