COMPOSITE MATERIAL, HEAT-ABSORBING COMPONENT, AND METHOD FOR PRODUCING THE COMPOSITE MATERIAL

In a known composite material with a fused silica matrix there are regions of silicon-containing phase embedded. In order to provide a composite material which is suitable for producing components for use in high-temperature processes for heat treatment even when exacting requirements are imposed on...

Full description

Saved in:
Bibliographic Details
Main Authors SCHENK, CHRISTIAN, SCHEICH, GERRIT, NEUMANN, CHRISTIAN, MICHEL, DIRK, MORITZ, STEPHAN, ATANOS, ASHUR, WESSELY, FRANK, TSCHOLITSCH, NADINE
Format Patent
LanguageEnglish
French
Published 14.05.2015
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:In a known composite material with a fused silica matrix there are regions of silicon-containing phase embedded. In order to provide a composite material which is suitable for producing components for use in high-temperature processes for heat treatment even when exacting requirements are imposed on impermeability to gas and on purity, it is proposed in accordance with the invention that the composite material be impervious to gas, have a closed porosity of less than 0.5% and a specific density of at least 2.19 g/cm3, and at a temperature of 1000°C have a spectral emissivity of at least 0.7 for wavelengths between 2 and 8 μm. Dans un matériau composite connu comportant une matrice de silice fondue, il subsiste des régions noyées de phase contenant du silicium. Pour obtenir un matériau composite qui convient à la production de composants utilisables dans des procédés de traitement thermique à haute température même quand des critères exigeants sont imposés sur l'imperméabilité aux gaz et sur la pureté, la solution selon l'invention porte sur un matériau composite imperméable aux gaz, ayant une porosité fermée inférieure à 0,5 % et une densité spécifique d'au moins 2,19 g/cm3, et ayant à une température de 1000°C une émissivité spectrale d'au moins 0,8 pour des longueurs d'ondes entre 2 et 8 µm.
Bibliography:Application Number: WO2014EP73906