SUBSTRATE FOR ORGANIC ELECTRONIC DEVICES AND PRODUCTION METHOD THEREFOR

The present invention provides a substrate for organic electronic devices, a production method therefor, and a use thereof. The substrate according to the present invention comprises: a flexible base film; and an inorganic layer, wherein the inorganic layer comprises a multilayer structure of at lea...

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Bibliographic Details
Main Author LEE, JUNG HYOUNG
Format Patent
LanguageEnglish
French
Korean
Published 02.04.2015
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Summary:The present invention provides a substrate for organic electronic devices, a production method therefor, and a use thereof. The substrate according to the present invention comprises: a flexible base film; and an inorganic layer, wherein the inorganic layer comprises a multilayer structure of at least two thin layers. The inorganic layer may have suppressed crystallinity and thus have good physical properties, such as barrier properties. Due to the multilayer structure, it is also possible to form an inorganic layer having physical properties which have been difficult to realize in conventional inorganic layers, such as a high refractive index, as well as barrier properties. La présente invention porte sur un substrat pour des dispositifs électroniques organiques, son procédé de fabrication, et une utilisation de ce dernier. Le substrat selon la présente invention comprend : un film de base flexible ; et une couche inorganique, la couche inorganique comprenant une structure multicouche d'au moins deux couches minces. La couche inorganique peut avoir une cristallinité supprimée et ainsi avoir de bonnes propriétés physiques, telles que des propriétés de barrière. En raison de la structure multicouche, il est également possible de former une couche inorganique ayant des propriétés physiques qui ont été difficiles à réaliser dans des couches inorganiques conventionnelles, telles qu'un indice de réfraction élevé, ainsi que des propriétés de barrière. 본 출원에서는, 유기전자소자용 기판, 그 제조방법 및 그 용도를 제공한다. 본 출원의 기판은 플렉서블 기재 필름과 무기물층을 포함하고, 상기 무기물층은 적어도 2층 이상의 얇은 두께의 층의 다층 구조를 포함한다. 이러한 무기물층은 결정성이 억제되어 우수한 물성, 예를 들면, 배리어성을 가질 수 있다. 또한, 상기 다층 구조의 채용을 통하여 상기와 같은 배리어성과 함께 종래에 무기물층에서는 구현하기 곤란하였던 물성, 예를 들면, 고굴절률을 겸비한 무기물층을 형성할 수 있다.
Bibliography:Application Number: WO2014KR09218