BONDING STAGE AND METHOD FOR MANUFACTURING SAME

This bonding stage is provided with: a rigid block (10) wherein a plurality of protrusions (11) are provided on a surface (16) thereof, said protrusions having flat upper surfaces, respectively; a flat board (20) that is fixed on supporting surfaces (18) on the protrusions (11); a ceramic board (30)...

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Bibliographic Details
Main Author WADA, SHOJI
Format Patent
LanguageEnglish
French
Japanese
Published 15.01.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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