BONDING STAGE AND METHOD FOR MANUFACTURING SAME

• Main Author: WADA, SHOJI
• Format: Patent
• Language: English; French; Japanese
• Published: 15.01.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

This bonding stage is provided with: a rigid block (10) wherein a plurality of protrusions (11) are provided on a surface (16) thereof, said protrusions having flat upper surfaces, respectively; a flat board (20) that is fixed on supporting surfaces (18) on the protrusions (11); a ceramic board (30) that is fixed on the flat board (20) by being sucked; a board-like heater (40) that is disposed on the rigid block (10) side of the flat board (20); and a coil spring (50), which is provided between the heater (40) and the rigid block (10), and which has the heater (40) adhered on a flat board (20) surface on the rigid block (10) side. La présente invention concerne une platine de liaison dotée : d'un bloc rigide (10) dont la surface (16) comporte une pluralité de protubérances (11), les surfaces supérieures desdites protubérances étant plates ; d'une plaque plate (20) fixée sur des surfaces de support (18) des protubérances (11) ; d'une plaque en céramique fixée par succion sur la plaque plate (20) ; d'un dispositif de chauffage (40) en forme de plaque placé sur le bloc rigide (10) du côté de la plaque plate (20) ; et d'un ressort hélicoïdal (50) placé entre le dispositif de chauffage (40) et le bloc rigide (10), ledit ressort permettant de fixer le dispositif de chauffage (40) sur la surface de la plaque plate (20) du côté du bloc rigide (10).