TANTALUM OXIDE FILM REMOVAL METHOD, AND REMOVAL DEVICE

The present invention holds a silicon substrate (W), which has a tantalum oxide film (10), to a spin chuck (3), and while rotating the silicon substrate (W) together with the spin chuck (3), supplies a mixed aqueous solution that contains hydrofluoric acid, and an organic acid to the silicon substra...

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Bibliographic Details
Main Authors DOBASHI KAZUYA, HAGIWARA AKIHITO
Format Patent
LanguageEnglish
French
Japanese
Published 24.12.2014
Subjects
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Summary:The present invention holds a silicon substrate (W), which has a tantalum oxide film (10), to a spin chuck (3), and while rotating the silicon substrate (W) together with the spin chuck (3), supplies a mixed aqueous solution that contains hydrofluoric acid, and an organic acid to the silicon substrate (W). Thus, the mixed aqueous solution that contains hydrofluoric acid, and an organic acid comes into contact with the tantalum oxide film (10), and the tantalum oxide film (10) is removed due to a chemical reaction of the mixed aqueous solution, and the tantalum oxide film (10). La présente invention maintient un substrat de silicium (W), lequel a une pellicule d'oxyde de tantale (10), sur un mandrin rotatif (3), et tout en faisant tourner le substrat de silicium (W) avec le mandrin rotatif (3), fournit un mélange en solution aqueuse qui contient de l'acide fluorhydrique et un acide organique au substrat de silicium (W). Ainsi, le mélange en solution aqueuse qui contient de l'acide fluorhydrique et un acide organique entre en contact avec la pellicule d'oxyde de tantale (10), et la pellicule d'oxyde de tantale (10) est retirée en raison d'une réaction chimique du mélange en solution aqueuse avec la pellicule d'oxyde de tantale (10).
Bibliography:Application Number: WO2014JP60318