HEAT RESISTANT POLYAMIDE COMPOSITIONS

Disclosed are heat resistant polyamide compositions including a) one or more polyamide resins, b) one or more reinforcing agents, c) a zinc compound; d) a copper heat stabilizer; and optionally, e) a polyhydric alcohol. L'invention concerne des compositions de polyamide thermorésistantes compre...

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Main Authors THOMPSON, JENNIFER, LEIGH, DUNCAN, ANDREW, JAY, MESSMORE, BENJAMIN, WEAVER
Format Patent
LanguageEnglish
French
Published 02.10.2014
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Abstract Disclosed are heat resistant polyamide compositions including a) one or more polyamide resins, b) one or more reinforcing agents, c) a zinc compound; d) a copper heat stabilizer; and optionally, e) a polyhydric alcohol. L'invention concerne des compositions de polyamide thermorésistantes comprenant a) une ou plusieurs résines polyamides, b) un ou plusieurs agents renforçateurs, c) un composé de zinc; d) un stabilisant thermique à base de cuivre; et éventuellement, e) un alcool polyhydrique.
AbstractList Disclosed are heat resistant polyamide compositions including a) one or more polyamide resins, b) one or more reinforcing agents, c) a zinc compound; d) a copper heat stabilizer; and optionally, e) a polyhydric alcohol. L'invention concerne des compositions de polyamide thermorésistantes comprenant a) une ou plusieurs résines polyamides, b) un ou plusieurs agents renforçateurs, c) un composé de zinc; d) un stabilisant thermique à base de cuivre; et éventuellement, e) un alcool polyhydrique.
Author MESSMORE, BENJAMIN, WEAVER
THOMPSON, JENNIFER, LEIGH
DUNCAN, ANDREW, JAY
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DocumentTitleAlternate COMPOSITIONS DE POLYAMIDE THERMORÉSISTANTES
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Snippet Disclosed are heat resistant polyamide compositions including a) one or more polyamide resins, b) one or more reinforcing agents, c) a zinc compound; d) a...
SourceID epo
SourceType Open Access Repository
SubjectTerms CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Title HEAT RESISTANT POLYAMIDE COMPOSITIONS
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