HEAT RESISTANT POLYAMIDE COMPOSITIONS

Disclosed are heat resistant polyamide compositions including a) one or more polyamide resins, b) one or more reinforcing agents, c) a zinc compound; d) a copper heat stabilizer; and optionally, e) a polyhydric alcohol. L'invention concerne des compositions de polyamide thermorésistantes compre...

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Main Authors THOMPSON, JENNIFER, LEIGH, DUNCAN, ANDREW, JAY, MESSMORE, BENJAMIN, WEAVER
Format Patent
LanguageEnglish
French
Published 02.10.2014
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:Disclosed are heat resistant polyamide compositions including a) one or more polyamide resins, b) one or more reinforcing agents, c) a zinc compound; d) a copper heat stabilizer; and optionally, e) a polyhydric alcohol. L'invention concerne des compositions de polyamide thermorésistantes comprenant a) une ou plusieurs résines polyamides, b) un ou plusieurs agents renforçateurs, c) un composé de zinc; d) un stabilisant thermique à base de cuivre; et éventuellement, e) un alcool polyhydrique.
Bibliography:Application Number: WO2014US31157