POLISHING PAD AND POLISHING METHOD

The present invention provides a polishing pad provided with a polishing member having a polishing surface, the polishing member containing a material having dilatancy characteristics. La présente invention porte sur un tampon de polissage, qui comporte un élément de polissage ayant une surface de p...

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Bibliographic Details
Main Authors DOI, TOSHIRO, SESHIMO, KIYOSHI, TAKAGI, MASATAKA, KASHIWADA, HIROSHI
Format Patent
LanguageEnglish
French
Japanese
Published 18.09.2014
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Summary:The present invention provides a polishing pad provided with a polishing member having a polishing surface, the polishing member containing a material having dilatancy characteristics. La présente invention porte sur un tampon de polissage, qui comporte un élément de polissage ayant une surface de polissage, l'élément de polissage contenant un matériau ayant des caractéristiques de dilatance.
Bibliography:Application Number: WO2014JP54851