DICING-SHEET SUBSTRATE FILM AND DICING SHEET

• Main Authors: TAYA NAOKI, UEDA MASASHI, ITO MASAHARU
• Format: Patent
• Language: English; French; Japanese
• Published: 03.07.2014
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

A dicing-sheet substrate film (2) equipped with a resin layer (A), wherein: the resin layer (A) contains a polyethylene (a1) having a density of 0.900g/cm3 or higher, and a styrene elastomer (a2); and the amount of the polyethylene (a1) contained represents 50-90 mass%, inclusive, of the total resin...