APPARATUS AND METHODS FOR SYMMETRICAL GAS DISTRIBUTION WITH HIGH PURGE EFFICIENCY

• Main Authors: HUSTON, JOEL M, CUVALCI, OLKAN, KAO, CHIEN-TEH, CHANG, MEI, YUAN, XIAOXIONG, LAM, HYMAN
• Format: Patent
• Language: English; French
• Published: 26.06.2014
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

Provided are apparatus and methods for depositing materials by vapor deposition and plasma enhanced vapor deposition techniques, and more particularly a gas distribution assembly and vapor deposition chamber to deposit a material. The gas distribution assembly comprises a plurality of sections with each section containing a flow channel with passages extending from the flow channel to the processing region of a processing chamber. L'invention concerne un appareil et des procédés qui permettent de déposer des matières par des techniques de dépôt en phase vapeur et de dépôt en phase vapeur activé par plasma et, plus particulièrement, un ensemble de distribution de gaz et une chambre de dépôt en phase vapeur pour déposer une matière. L'ensemble de distribution de gaz comporte une pluralité de sections, chaque section contenant un canal d'écoulement ayant des passages s'étendant du canal d'écoulement à la région de traitement d'une chambre de traitement.