COPOLYMERIZED POLYAMIDE RESIN, METHOD FOR MANUFACTURING SAME, AND MOLDING COMPRISING SAME

• Main Authors: JUN, SUK MIN, JANG, SEUNG HYUN, IM, SANG KYUN, BANG, SEUNG YOUB, LEE, EUN JU, KIM, JIN KYU, LEE, KI YON, KWON, SO YOUNG
• Format: Patent
• Language: English; French; Korean
• Published: 26.06.2014
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

The present invention relates to a copolymerized polyamide resin is characterized by comprising: (A) dicarboxylic acid; and (B) repeating units which are a diamine polymer and comprising phenylene oxide units. The copolymerized polyamide resin can have excellent heat resistance, melt processability and dimensional stability, and low hygroscopic property. L'invention concerne une résine de polyamide copolymérisée caractérisée en ce qu'elle contient : (A) un acide dicarboxylique ; et (B) des unités répétées de polymère diamine comprenant des unités d'oxyde de phénylène. La résine de polyamide copolymérisée présente une excellente résistance thermique, une excellente aptitude au traitement à l'état fondu et une excellente stabilité dimensionnelle, et est très peu hygroscope.