PROTECTIVE-MEMBRANE-FORMING FILM

This protective-membrane-forming film, which is used to form a protective membrane that protects a semiconductor chip, contains an acrylic polymer (A), a curable epoxy component (B), and a filler (C). Epoxy-group-containing monomers constitute no more than 8% of the total mass of the monomers consti...

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Main Authors TAKANO, KEN, SHINODA, TOMONORI, AZUMA, YUICHIRO
Format Patent
LanguageEnglish
French
Japanese
Published 12.06.2014
Subjects
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Abstract This protective-membrane-forming film, which is used to form a protective membrane that protects a semiconductor chip, contains an acrylic polymer (A), a curable epoxy component (B), and a filler (C). Epoxy-group-containing monomers constitute no more than 8% of the total mass of the monomers constituting the acrylic polymer (A). The glass transition temperature of the acrylic polymer (A) is greater than or equal to −3°C, and at least one surface of the protective membrane obtained by curing this protective-membrane-forming film has a gloss value of at least 20 as measured in accordance with JIS Z 8741. La présente invention concerne un film de formation de membrane protectrice, qui est utilisé pour former une membrane protectrice qui protège une puce de semi-conducteur, contenant un polymère acrylique (A), un constituant époxy durcissable (B), et un élément de remplissage (C). Des monomères contenant un groupe époxy ne constituent pas plus de 8 % de la masse totale des monomères constituant le polymère acrylique (A). La température de transition vitreuse du polymère acrylique (A) est supérieure ou égale à −3°C, et au moins une surface de la membrane protectrice obtenue par durcissement de ce film de formation de membrane protectrice présente une valeur de brillance d'au moins 20 mesurée selon JIS Z 8741.
AbstractList This protective-membrane-forming film, which is used to form a protective membrane that protects a semiconductor chip, contains an acrylic polymer (A), a curable epoxy component (B), and a filler (C). Epoxy-group-containing monomers constitute no more than 8% of the total mass of the monomers constituting the acrylic polymer (A). The glass transition temperature of the acrylic polymer (A) is greater than or equal to −3°C, and at least one surface of the protective membrane obtained by curing this protective-membrane-forming film has a gloss value of at least 20 as measured in accordance with JIS Z 8741. La présente invention concerne un film de formation de membrane protectrice, qui est utilisé pour former une membrane protectrice qui protège une puce de semi-conducteur, contenant un polymère acrylique (A), un constituant époxy durcissable (B), et un élément de remplissage (C). Des monomères contenant un groupe époxy ne constituent pas plus de 8 % de la masse totale des monomères constituant le polymère acrylique (A). La température de transition vitreuse du polymère acrylique (A) est supérieure ou égale à −3°C, et au moins une surface de la membrane protectrice obtenue par durcissement de ce film de formation de membrane protectrice présente une valeur de brillance d'au moins 20 mesurée selon JIS Z 8741.
Author AZUMA, YUICHIRO
TAKANO, KEN
SHINODA, TOMONORI
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DocumentTitleAlternate FILM DE FORMATION DE MEMBRANE PROTECTRICE
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Snippet This protective-membrane-forming film, which is used to form a protective membrane that protects a semiconductor chip, contains an acrylic polymer (A), a...
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SubjectTerms ADHESIVES
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
BASIC ELECTRIC ELEMENTS
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
CORRECTING FLUIDS
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FILLING PASTES
GENERAL PROCESSES OF COMPOUNDING
INKS
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
PERFORMING OPERATIONS
POLISHES
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
USE OF MATERIALS THEREFOR
WOODSTAINS
WORKING-UP
Title PROTECTIVE-MEMBRANE-FORMING FILM
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