APPARATUS AND METHODS FOR BACKSIDE PASSIVATION

Provided apparatus and methods for back side passivation of a substrate. The systems comprise an elongate support with an open top surface forming a support ring so that when a substrate is on the support ring, a cavity is formed within the elongate support. A plasma generator is coupled to the cavi...

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Bibliographic Details
Main Authors TOBIN, JEFF, HAWRYLCHAK, LARA
Format Patent
LanguageEnglish
French
Published 30.05.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Provided apparatus and methods for back side passivation of a substrate. The systems comprise an elongate support with an open top surface forming a support ring so that when a substrate is on the support ring, a cavity is formed within the elongate support. A plasma generator is coupled to the cavity to generate a plasma within the cavity to deposit a passivation film on the back side of the substrate. L'invention concerne un appareil et des procédés pour passivation du côté arrière d'un substrat. Les systèmes comprennent un support allongé avec une surface supérieure ouverte formant une bague de support de telle sorte que lorsque le substrat est placé sur la bague de support, une cavité est formée à l'intérieur du support allongé. Un générateur de plasma est couplé à la cavité afin de générer un plasma à l'intérieur de cette dernière pour déposer un film de passivation sur le côté arrière du substrat.
Bibliography:Application Number: WO2013US71673