COOLING SYSTEM

The present invention relates to a cooling system. The cooling system comprises: a chasis (20), used for holding a board in an orthogonal structure, the board comprising a vertical plug plate (22); a first fan group (25), mounted in a first inlet air pipe on the upper side of the front of the chasis...

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Bibliographic Details
Main Authors HAO, MINGLIANG, DONG, YUAN, BAI, LEI
Format Patent
LanguageChinese
English
French
Published 30.05.2014
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The present invention relates to a cooling system. The cooling system comprises: a chasis (20), used for holding a board in an orthogonal structure, the board comprising a vertical plug plate (22); a first fan group (25), mounted in a first inlet air pipe on the upper side of the front of the chasis (20), and used for guiding air into the chasis (20); and an air guide cavity (23), mounted in the chasis (20), and used for delivering air guided into the chasis (20) by the first fan group (25) to hotspot components (221, 222, 223, 224, 225, 226) of the vertical plug plate (22) for cooling. The cooling system of the embodiments of the present invention implements independent air supply for hotspot components on a vertical plug plate in a communication system device based on an orthogonal architecture, breaks the upper and lower temperature cascade of the components, saves the heat conduction space, and improves the cooling capability of the system. La présente invention concerne un système de refroidissement. Le
Bibliography:Application Number: WO2013CN74880