ENHANCED CAPTURE PADS FOR THROUGH SEMICONDUCTOR VIAS

• Main Authors: LAFONTANT, GARY, VOLANT, RICHARD, P, PETRARC, KEVIN, S, FAROOQ, MUKTA, G, GRIESEMER, JOHN, A
• Format: Patent
• Language: English; French
• Published: 15.05.2014
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Method of forming a capture pad on a semiconductor substrate. The method includes providing a semiconductor substrate [300] having an active side and an inactive side and having a plurality of unfilled TSVs extending between the active side and the inactive side; filling the TSVs [304] with a metal...