TREATMENT OF FILAMENTS OR YARN IN ORDER TO IMPROVE THE ADHESION OF RUBBER

• Main Authors: FELTON, ERIC, DIAZ, JAYCOX, GARY, DELMAR
• Format: Patent
• Language: English; French
• Published: 28.08.2014
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; CHEMISTRY; DYES; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR; LAUNDERING; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SPRAYING OR ATOMISING IN GENERAL; TEXTILES; TRANSPORTING; TREATMENT OF TEXTILES OR THE LIKE; TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS,FABRICS, FEATHERS, OR FIBROUS GOODS MADE FROM SUCH MATERIALS; USE OF MATERIALS AS ADHESIVES

A method for treating an aromatic polyamide filament or yarn to improve its adhesion to rubber wherein, the method comprises exposing the filament or yarn to a first mixture of reagents comprising multi-functional isocyanate oligomers and multi-functional epoxy oligomers, wherein the ratio of total isocyanate groups to total epoxy groups in the mixture is in the range of from 0.8 to 1.2, and heating the exposed filament or yarn to a temperature of at least 100 degrees C whereby the epoxy and isocyanate oligomers cross-link and form a network on the surface of the filament or yarn. L'invention concerne un procédé de traitement d'un filament ou d'un fil de polyamide aromatique pour améliorer son adhésion à du caoutchouc le procédé comprenant l'exposition du filament ou du fil à un premier mélange de réactifs comprenant des oligomères isocyanate multifonctionnels et des oligomères époxy multifonctionnels, le rapport des groupes isocyanate totaux aux groupes époxy totaux dans le mélange se situant dans la plage de 0,8 à 1,2, et le chauffage du filament ou du fil exposé à une température d'au moins 100 degrés C ce par quoi les oligomères époxy et isocyanate se réticulent et forment un réseau sur la surface du filament ou du fil.