THERMOSETTING RESIN COMPOSITION
The present invention relates to a thermosetting resin composition which contains the following components (A)-(D). (A) a thermosetting resin containing an SiH group and an alkenyl group, said thermosetting resin being a reaction product of a silsesquioxane having an SiH group and an organopolysilox...
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| Main Authors | , , , |
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| Format | Patent |
| Language | English French Japanese |
| Published |
01.05.2014
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| Subjects | |
| Online Access | Get full text |
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| Abstract | The present invention relates to a thermosetting resin composition which contains the following components (A)-(D). (A) a thermosetting resin containing an SiH group and an alkenyl group, said thermosetting resin being a reaction product of a silsesquioxane having an SiH group and an organopolysiloxane having two alkenyl groups (B) a linear organopolysiloxane compound having an SiH group only at one end (C) a silane coupling agent having an epoxy group (D) a Pt catalyst
Cette invention concerne une composition de résine thermodurcissable qui contient les composants (A)-(D) suivants. (A) une résine thermodurcissable contenant un groupe SiH et un groupe alcényle, ladite résine thermodurcissable étant le produit de la réaction d'un silsesquioxane ayant un groupe SiH et d'un organopolysiloxane ayant deux groupes alcényle (B) un composé d'organopolysiloxane linéaire ayant un groupe SiH uniquement à une extrémité (C) un agent de couplage silane ayant un groupe époxy (D) un catalyseur Pt |
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| AbstractList | The present invention relates to a thermosetting resin composition which contains the following components (A)-(D). (A) a thermosetting resin containing an SiH group and an alkenyl group, said thermosetting resin being a reaction product of a silsesquioxane having an SiH group and an organopolysiloxane having two alkenyl groups (B) a linear organopolysiloxane compound having an SiH group only at one end (C) a silane coupling agent having an epoxy group (D) a Pt catalyst
Cette invention concerne une composition de résine thermodurcissable qui contient les composants (A)-(D) suivants. (A) une résine thermodurcissable contenant un groupe SiH et un groupe alcényle, ladite résine thermodurcissable étant le produit de la réaction d'un silsesquioxane ayant un groupe SiH et d'un organopolysiloxane ayant deux groupes alcényle (B) un composé d'organopolysiloxane linéaire ayant un groupe SiH uniquement à une extrémité (C) un agent de couplage silane ayant un groupe époxy (D) un catalyseur Pt |
| Author | AYAMA KOICHI MATSUO TAKASHI TAJIMA AKIO KAWABATA KIICHI |
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| DocumentTitleAlternate | COMPOSITION DE RÉSINE THERMODURCISSABLE |
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| Notes | Application Number: WO2013JP77848 |
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| RelatedCompanies | JNC CORPORATION |
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| Snippet | The present invention relates to a thermosetting resin composition which contains the following components (A)-(D). (A) a thermosetting resin containing an SiH... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| Title | THERMOSETTING RESIN COMPOSITION |
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