THERMOSETTING RESIN COMPOSITION

The present invention relates to a thermosetting resin composition which contains the following components (A)-(D). (A) a thermosetting resin containing an SiH group and an alkenyl group, said thermosetting resin being a reaction product of a silsesquioxane having an SiH group and an organopolysilox...

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Main Authors AYAMA KOICHI, MATSUO TAKASHI, KAWABATA KIICHI, TAJIMA AKIO
Format Patent
LanguageEnglish
French
Japanese
Published 01.05.2014
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Abstract The present invention relates to a thermosetting resin composition which contains the following components (A)-(D). (A) a thermosetting resin containing an SiH group and an alkenyl group, said thermosetting resin being a reaction product of a silsesquioxane having an SiH group and an organopolysiloxane having two alkenyl groups (B) a linear organopolysiloxane compound having an SiH group only at one end (C) a silane coupling agent having an epoxy group (D) a Pt catalyst Cette invention concerne une composition de résine thermodurcissable qui contient les composants (A)-(D) suivants. (A) une résine thermodurcissable contenant un groupe SiH et un groupe alcényle, ladite résine thermodurcissable étant le produit de la réaction d'un silsesquioxane ayant un groupe SiH et d'un organopolysiloxane ayant deux groupes alcényle (B) un composé d'organopolysiloxane linéaire ayant un groupe SiH uniquement à une extrémité (C) un agent de couplage silane ayant un groupe époxy (D) un catalyseur Pt
AbstractList The present invention relates to a thermosetting resin composition which contains the following components (A)-(D). (A) a thermosetting resin containing an SiH group and an alkenyl group, said thermosetting resin being a reaction product of a silsesquioxane having an SiH group and an organopolysiloxane having two alkenyl groups (B) a linear organopolysiloxane compound having an SiH group only at one end (C) a silane coupling agent having an epoxy group (D) a Pt catalyst Cette invention concerne une composition de résine thermodurcissable qui contient les composants (A)-(D) suivants. (A) une résine thermodurcissable contenant un groupe SiH et un groupe alcényle, ladite résine thermodurcissable étant le produit de la réaction d'un silsesquioxane ayant un groupe SiH et d'un organopolysiloxane ayant deux groupes alcényle (B) un composé d'organopolysiloxane linéaire ayant un groupe SiH uniquement à une extrémité (C) un agent de couplage silane ayant un groupe époxy (D) un catalyseur Pt
Author AYAMA KOICHI
MATSUO TAKASHI
TAJIMA AKIO
KAWABATA KIICHI
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DocumentTitleAlternate COMPOSITION DE RÉSINE THERMODURCISSABLE
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Snippet The present invention relates to a thermosetting resin composition which contains the following components (A)-(D). (A) a thermosetting resin containing an SiH...
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SubjectTerms BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Title THERMOSETTING RESIN COMPOSITION
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