ETCHING MATERIAL

• Main Authors: INADA, MAKI, KURODA, KYOKO, KUMASHIRO, YASUSHI, NAKAKO, HIDEO, NOUDOU, TAKAAKI
• Format: Patent
• Language: English; French; Japanese
• Published: 24.04.2014
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; POLISHES; REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE

An etching material which contains at least one boron compound that is selected from among Lewis acids that contain, in the structures thereof, a boron atom and a halogen atom that is bonded to the boron atom, salts of the Lewis acids, and compounds that generate the Lewis acids. La présente invention a trait à un décapant qui contient au moins un composé de bore qui est choisi parmi les acides de Lewis qui contiennent, dans leurs structures, un atome de bore et un atome d'halogène qui est lié à l'atome de bore, les sels des acides de Lewis et les composés qui génèrent les acides de Lewis.