SOLDER ON TRACE TECHNOLOGY FOR INTERCONNECT ATTACHMENT

A solder on trace device includes a conductive trace on a semiconductor substrate surface. The conductive trace has a sidewall and a bonding surface. The solder on trace device also includes a passivation layer on at least one end of the conductive trace. The solder on trace device further includes...

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Bibliographic Details
Main Authors BCHIR, OMAR, JAMES, KUMAR, RAJNEESH
Format Patent
LanguageEnglish
French
Published 20.02.2014
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A solder on trace device includes a conductive trace on a semiconductor substrate surface. The conductive trace has a sidewall and a bonding surface. The solder on trace device also includes a passivation layer on at least one end of the conductive trace. The solder on trace device further includes a pre-solder material on the sidewall and the bonding surface of the conductive trace. La présente invention porte sur une soudure sur un dispositif de tracé qui comprend un tracé conducteur sur une surface de substrat de semi-conducteur. Le tracé conducteur comprend une paroi latérale et une surface de liaison. La soudure sur le dispositif de tracé comprend également une couche de passivation sur au moins une extrémité du tracé conducteur. La soudure sur le dispositif de tracé comprend en outre un matériau de pré-soudure sur la paroi latérale et la surface de liaison du tracé conducteur.
Bibliography:Application Number: WO2013US54849